Systems and methods for packaging high density SSDS

ABSTRACT

In various embodiments, a high-density solid-state storage unit includes a base section and a cassette section having plurality of flash cards. The cassette section can be removably attached to the base section to provide security of data stored on the plurality of flash cards. The cassette section provides for physical security of the flash cards in part through packaging of the enclosure and energy transfer to the base station. The cassette section further provides for security of the data stored on the flash cards in part through a trusted platform module (TPM) embodied as a removable module connected to a universal serial bus (USB) style connector.

BACKGROUND OF THE INVENTION

Information technology is in the throes of a dramatic transformation.Virtualization is giving way to cloud computing; the ubiquity ofpowerful handheld devices is creating new paradigms in mobility andsocial interaction; the massive profusion of information generation isleading to powerful new opportunities for Big Data analytics. Cloudcomputing has been called “a disruptive force” with the potential forlong-term impact on most industries.

Additionally, nowhere is this need for next-generation performance andcapacity more critical than in enterprise storage solutions.Organizations are creating more data than ever before and datageneration is growing at a staggering rate.

It's not just storage capacity that's a challenge to computing's newparadigm: Speed and performance are equally crucial. Organizations mustbe able to access their most important data as quickly as possible toact upon it effectively. They need solutions that minimize latency,maximize input/output operations per second (IOPS) and deliver maximumcapacity and performance in a cost-efficient manner. Otherwise the costof delivering sufficient storage capacity and performance will cripplethis new computing paradigm before it ever gets its sealegs.

The storage industry has made great strides in adapting technology todeliver more capacity and better performance without congruent increasesin costs. Solutions such as compression, deduplication and intelligenttiering have made today's disk storage systems far more efficient andhave enabled the widespread proliferation of virtualization that has setthe stage for the transition to cloud computing.

But those solutions go just so far: Spinning disk storage has practicallimitations in speed and performance. The real promise fornext-generation performance has always been in solid-state technology.Solid-state technology employs non-volatile flash memory so there are nomoving parts, meaning solid-state solutions operate much faster thantraditional disk drives in reading and writing data. A singleenterprise-grade solid-state solution can handle a transaction workloadof 100 traditional hard drives—with more reliability and less powerconsumption in a much smaller physical space.

Most of the leading enterprise storage vendors incorporate solid-statetechnology as part of their overall solutions, but in limited capacitiesusually targeted for specific, storage-intensive production applicationsthat require very high levels of performance: Video editing,computer-aided design and high-end online transaction processing systems(OLTPs) are some of the obvious choices.

The challenge in deploying solid-state technology more ubiquitouslyacross the enterprise—for all enterprise applications—has been one ofcost. Although NAND Flash solutions could deliver 100 times theperformance of traditional spinning disks—at one tenth the powerconsumption—they have also been about 10 times more expensive to deploy.

Simply, the cost of deploying robust enterprise-grade solid-statetechnology has been too high for widespread deployment across allenterprise applications. However, that excuse will not suffice for thefuture, as the performance level ensured by solid-state technologybecomes even more critical for all applications across all types ofbusinesses.

The reality is that the capacity and performance of solid-statetechnology will be a necessary part of next-generation data centerinfrastructures if these infrastructures are to deliver on the promiseof cloud computing, Big Data and all of the other critical aspects ofcomputing's next era. Enterprise-grade solid-state technology will becrucial to the underlying storage infrastructure—driving all enterpriseapplications—to meet ever-changing requirements for performance, speed,capacity, and agility.

Next-generation solid-state technology for the enterprise must berobust, reliable, fully featured, and cost-efficient: It must go beyondwhat is available in solid-state today, particularly when ITdecision-makers think about typical solid-state drives (SSDs) that useHDD protocols to speak to the rest of the world. This deployment ofsolid-state technology has been useful in their initial applications,such as in laptop computing, but is nowhere near the right design fortrue enterprise-grade solid-state storage. The challenge to the storageindustry has been to figure out how to deliver enterprise-gradeperformance and reliability in solid-state technology at a reasonablecost for widespread enterprise appeal.

Accordingly, what is desired is to solve problems relating to packagingand security of solid-state storage units, some of which may bediscussed herein. Additionally, what is desired is to reduce drawbacksrelating to packaging and security of solid-state storage units, some ofwhich may be discussed herein.

BRIEF SUMMARY OF THE INVENTION

The following portion of this disclosure presents a simplified summaryof one or more innovations, embodiments, and/or examples found withinthis disclosure for at least the purpose of providing a basicunderstanding of the subject matter. This summary does not attempt toprovide an extensive overview of any particular embodiment or example.Additionally, this summary is not intended to identify key/criticalelements of an embodiment or example or to delineate the scope of thesubject matter of this disclosure. Accordingly, one purpose of thissummary may be to present some innovations, embodiments, and/or examplesfound within this disclosure in a simplified form as a prelude to a moredetailed description presented later.

In various embodiments, a high-density solid-state storage unit includesa base section and a cassette section having plurality of flash cards.The cassette section can be removably attached to the base section toprovide security of data stored on the plurality of flash cards. Thecassette section provides for physical security of the flash cards inpart through packaging of the enclosure and energy transfer to the basestation. The cassette section further provides for security of the datastored on the flash cards in part through a trusted platform module(TPM) embodied as a removable module connected to a universal serial bus(USB) style connector.

In one aspect, a data storage unit includes a base section and acassette section. The cassette section is configured to be removablyattached to the base section. The cassette section includes an interfacethrough which a plurality of solid-state storage modules located withinthe cassette section are accessible to the base section. The pluralityof solid-state storage modules are arranged in a vertical fashion fromthe front of the cassette section to the back of the cassette sectiontogether with a bridge board that electronically connects the interfaceat the back of the cassette section to one or more components at thefront of the cassette section.

In one embodiment, the interface of the cassette section is configuredto provide both an electrical connection between the cassette sectionand the base section as well as energy transfer from the cassettesection to the base section. The interface transfers vibrations andother mechanical energies from the cassette section to the base stationreduce the potential for physical damage to the cassette section and anycomponents therein.

In another aspect, the cassette section further includes one or moreguides. The guides are configured to assist with insertion of thecassette section into the base section. Each guide has a taper from oneend of the cassette section toward another end of the cassette section.The taper is configured to provide self-guiding of the cassette sectionupon insertion into the base section. The one or more guides may beconfigured to provide energy transfer to the base section and the basesection may be configured to receive the energy transfer through the oneor more guides. The one or more guides may further include a first wedgereceptor opposite a second wedge receptor to assist with initialinsertion.

In further embodiments, the cassette section includes various gapfilling materials. A gap filling material may be placed between one ormore internal components of the cassette section and an enclosing plateof the cassette section. A gap filling material may account forvariation in the manufacturing process. A gap filling material mayfurther be configured to reduce vibration of the cassette section.

In some aspects, the base section includes one or more structuresforming a plurality of environmental zones. At least one of theplurality of environmental zones may be designated for the cassettesection.

In another embodiment, a data cassette includes an interface throughwhich solid-state storage modules are accessible to a base section and aplurality of solid-state storage modules arranged in a vertical fashionfrom the front of the cassette section to the back of the cassettesection together with a bridge board that electronically connects theinterface at the back of the cassette section to one or more componentsat the front of the cassette section.

In a further embodiment, the data cassette receives a trusted platformmodule that includes an interface having a universal serial bus (USB)style connector configured to be inserted into to the cassette section.The trusted platform module further includes circuitry configured tomanage access to data stored in the plurality of solid-state storagemodules from the base section.

In some aspects, the interface is configured as a USB 2.0 or 3.0Standard-A type plug with a flattened rectangle that inserts into a USB2.0 or 3.0 Standard-A type plug receptacle of the cassette section. Thecircuitry may be configured to manage access to the data stored in theplurality of solid-state storage modules from the base section utilizingcircuitry configured to provide platform integrity. The circuitry may beconfigured to manage access to the data stored in the plurality ofsolid-state storage modules from the base section utilizing circuitryconfigured to manage encryption keys for the data stored in theplurality of solid-state storage modules. The circuitry may beconfigured to manage access to the data stored in the plurality ofsolid-state storage modules from the base section utilizing circuitryconfigured to manage both the data and metadata stored in the pluralityof solid-state storage modules.

A further understanding of the nature of and equivalents to the subjectmatter of this disclosure (as well as any inherent or express advantagesand improvements provided) should be realized in addition to the abovesection by reference to the remaining portions of this disclosure, anyaccompanying drawings, and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to reasonably describe and illustrate those innovations,embodiments, and/or examples found within this disclosure, reference maybe made to one or more accompanying drawings. The additional details orexamples used to describe the one or more accompanying drawings shouldnot be considered as limitations to the scope of any of the claimedinventions, any of the presently described embodiments and/or examples,or the presently understood best mode of any innovations presentedwithin this disclosure.

FIG. 1 is a diagram of a high-density solid-state storage unit having abase and a cassette in one embodiment according to the presentinvention.

FIGS. 2A-2F are different views illustrating the high-densitysolid-state storage unit of FIG. 1 in one embodiment according to thepresent invention.

FIG. 3 is a diagram of the cassette of the high-density solid-statestorage unit of FIG. 1 in one embodiment according to the presentinvention.

FIGS. 4A-4D are different views illustrating the cassette of FIG. 3 inone embodiment according to the present invention.

FIG. 5 is a diagram illustrating the packaging of various internalelements of the cassette of FIG. 1 in one embodiment according to thepresent invention.

FIGS. 6A-6B are diagrams illustrating elements of the cassette of FIG. 3that provide security and vibration reduction in one embodiment of thepresent invention.

FIG. 7 is a diagram illustrating a cross section of the cassette of FIG.3 having dual temperature zones in one embodiment of the presentinvention.

FIG. 8 is a diagram illustrating a data security feature of the cassetteof FIG. 3 in one embodiment of the present invention.

FIG. 9 is a simplified block diagram of a computer system that may beused to practice embodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

In various embodiments, a high-density solid-state storage unit includesa base section and a cassette section having plurality of flash cards.The cassette section can be removably attached to the base section toprovide security of data stored on the plurality of flash cards. Thecassette section provides for physical security of the flash cards inpart through packaging of the enclosure and energy transfer to the basestation. The cassette section further provides for security of the datastored on the flash cards in part through a trusted platform module(TPM) embodied as a removable module connected to a USB connector.

Introduction

FIG. 1 is a diagram of high-density solid-state storage unit 100 havinga base and a cassette in one embodiment according to the presentinvention. High-density solid-state storage unit 100 may be embodied asan all-Flash enterprise solid-state storage system. Examples ofhigh-density solid-state storage unit 100 can be embodied similar toproducts provided by Skyera Inc. of San Jose, Calif.

Solid-state storage unit 100 typically includes two components in whichhardware and/or software elements are arranged, base section 110 andcassette section 120. Base section 110 and cassette section 120 caninclude elements and components typically found within consumer andenterprise grade computers and storage equipment. This may include oneor more processors having one or more cores, memories, busses andinterfaces, power systems, ventilation systems, and the like.Solid-state storage unit 100 is typically constructed from steel,aluminum, plastics, or other alloys and materials typically used inconsumer or enterprise grade hardware.

Solid-state storage unit 100 may be embodied similar to conventionalserver storage units that include hard-drive based or similar storagedevices. Solid-state storage unit 100 may be configured for installationinto one or more server racks. Server rack generally can hold multiplepieces of rack-mountable units that are designed to fit in the serverrack. Each rack-mountable unit can generally be one of several standarddimensions measured in terms or a ‘rack unit.’ A rack unit, U or RU is aunit of measure used to describe the height of equipment intended formounting in a 19-inch rack or a 23-inch rack. The 19-inch (48.26 cm) or23-inch (58.42 cm) dimension refers to the width of the equipmentmounting frame in the rack, i.e. the width of the equipment that can bemounted inside the rack. One rack unit (1 U) is 1.75 inches (44.45 mm)high. The size of a piece of rack-mounted equipment is frequentlydescribed as a number in “U”. For example, one rack unit is oftenreferred to as “1 U”, 2 rack units as “2 U” and so on.

High-density solid-state storage 100 may also be embodied as anycomputing device, such as a personal computer (PC), a workstation, amini-computer, a mainframe, a cluster or farm of computing devices, alaptop, a notebook, a netbook, a PDA, a smartphone, a consumerelectronic device, a gaming console, or the like.

In general, base section 110 is configured to control and manage theoperation of solid-state storage unit 100 with respect to externalaccess to data stored in cassette section 120. In various embodiment,base section 110 may include one or more central processing units(CPUs), memories, and interfaces. Base section 110 includes hardwareand/or software elements configured for performing logic operations andcalculations, input/output operations, machine communications, or thelike. Base section 110 may include familiar computer components, such asone or more data processors, one or more graphics processors orgraphical processing units (GPUs), one or more memory subsystems, one ormore storage subsystems, one or more input/output (I/O) interfaces,communications interfaces, or the like. Base section 110 can include oneor more systems interconnecting components and providing functionality,such connectivity and inter-device communication.

In various embodiments, base section 110 may include software thatenables communications over a network, such as a local area network orthe Internet, using one or more communications protocols, such as theHTTP, TCP/IP, RTP/RTSP protocols, or the like. In some embodiments,other communications software and/or transfer protocols may also beused, for example IPX, UDP or the like, for communicating with hostsover the network or with a device directly or indirectly connected tobase section 110. In further embodiments, base section 110 may includesoftware that enables network attached storage (NAS) communications,direct attached storage (DAS) communications, storage area network (SAN)communications, or the like. In some embodiments, other data storagesoftware, transfer protocols, or interconnets may also be used, forexample ATA over Ethernet (AoE) mapping of ATA over Ethernet, FibreChannel Protocol (FCP) mapping of SCSI over Fibre Channel, Fibre Channelover Ethernet (FCoE), ESCON over Fibre Channel (FICON), HyperSCSImapping of SCSI over Ethernet, iFCP or SANoIP mapping of FCP over IP,iSCSI mapping of SCSI over TCP/IP, iSCSI Extensions for RDMA (iSER)mapping of iSCSI over InfiniBand, storage networks may also be builtusing SAS and SATA technologies, or the like.

In some embodiments, base section 110 may maintain a variety oftemperature zones using one or more techniques described in detailbelow.

In general, cassette section 120 is configured to manage access to datastored in a plurality of storage modules located within cassette section120. Cassette section 120 may include one or more central processingunits (CPUs), memories, and interfaces. Cassette section 120 may includehardware and/or software elements configured for performing logicoperations and calculations, input/output operations, machinecommunications, or the like. Cassette section 120 may include familiarcomputer components, such as one or more data processors, one or moregraphics processors or graphical processing units (GPUs), one or morememory subsystems, one or more storage subsystems, one or moreinput/output (I/O) interfaces, communications interfaces, or the like.Cassette section 120 can include one or more systems interconnectingcomponents and providing functionality, such connectivity andinter-device communication.

In various embodiments, cassette section 120 is configured to beremovably attached to base section 110. This allows cassette section 120to be physically removed from base section 110 to provide enhanced datasecurity. Cassette section 120 can be physically secured to furtherprevent unauthorized access to the data stored thereon. Cassette section120 may be configured to be insertable only in corresponding basesection 110 or cassette section 120 may be configured to be insertableinto any compatible base section. In some embodiments, cassette section120 is configured to rely upon or otherwise utilize hardware and/orsoftware elements of base section 110 that are configured for performinglogic operations and calculations, input/output operations, machinecommunications, or the like.

Cassette section 120 typically includes multiple storage modules. Aplurality of storage modules may be arranged side-by-side. The pluralityof storage modules may be arranged in a vertical orientation extendingfrom a shared circuit board. Each storage module preferably includessolid-state memory that can provide between 8 and 10 terabytes ofstorage capacity. One skilled in the art will realize that the amount ofstorage capacity on each storage module is primarily limited by theavailable capacity of memory devices. Advances in solid-state memorytechnology will result in a single memory device being able to holdterabytes of data in the near future. At such time, the storage capacityof each memory module can be greatly enhanced by using suchhigh-capacity memory devices. Therefore, the memory capacity numbersdescribed above are based on the technology available today. Thesenumbers are provided merely as an example and should not be construed aslimiting the claimed invention in any manner. One skilled in the artwill realize that the storage capacity can be increased further usingthe concepts described in this application as newer technology isavailable in the future.

FIGS. 2A-2F are different views illustrating high-density solid-statestorage unit 100 of FIG. 1 in one embodiment according to the presentinvention. In this example, FIG. 2A depicts a front view of high-densitysolid-state storage unit 100. As can be seen, base section 110 includesone or more vents at which one or more fans may be mounted to blow airinwards into base section 110, for example, to support cooling ofinternal electronics. Cassette section 120 includes one or more vents atwhich one or more fans may be mounted to blow air inwards into cassettesection 110, for example, to support cooling of internal electronics andthe multiple storage modules.

Cassette section 120 may include one or more physical mechanisms forbeing physically secured, connected, or coupled to base section 110. Forexample, FIG. 2A illustrates one or more screws for securing cassettesection 120 to base section 110. Cassette section 120 may include one ormore guides, rails, tracks, of other features that facilitate howcassette section 120 is secured to base section 110. In some aspects, aninterface between cassette section 120 and base section of a securingmechanism may serve multiple purposes, such as providing an electricalconnection as well as providing energy transfer for reducing ordampening vibration in cassette section 120.

FIG. 2B depicts a back view of high-density solid-state storage unit 100opposing the front view of FIG. 2A. As can be seen, base section 110includes one or more vents at which one or more fans may be mounted toblow air outwards from base section 110. Base section 110 may includeone or more interfaces, such as ethernet, universal serial bus (USB),monitor ports, and the like that facilitate connections to externalcomponents. Base section 110 may further include one or more powersupplies in a variety of known configurations.

FIG. 2C depicts a left view of high-density solid-state storage unit100. Base section 110 may include one or more openings, interfaces, andthe like that allow base section 110 to be secured to a rack or cabinetfor operation. FIG. 2D depicts a right view of high-density solid-statestorage unit 100. FIG. 2E depicts a top view of high-density solid-statestorage unit 100. FIG. 2F depicts a bottom view of high-densitysolid-state storage unit 100.

In these example, it is more clearly illustrated to removable nature ofcassette section 120 from base section 110. Allowing cassette section120 to be easily removed from base section 110 provides a variety ofadvantages. Traditionally, hard drives provide the medium for removablestorage. However, even though the density of hard drives has increased,their volume or form factor has remained the same. Cassette section 120provides high density storage with the benefit of removability for theadded protection of the data stored thereon.

Removability of cassette section 120 from base section 110 also provideschallenges some of which are discussed in further detail below. Forexample, there is a need to provide electrical and physical couplingbetween base section 110 and cassette section 120. The electrical andphysical coupling needs to be strong enough to withstand a productlifetime of insertion and removal cycles. In yet further example, aninsertion should be relatively easy to perform and secure. In anotherexample, there is a need to reduce noise and vibrations that may Occur.

Cassette Packaging

In various embodiments, cassette section 120 includes one or morefeatures directed to packaging the multiple storage modules. One featureprovides an electrical and physical coupling between base section 110and cassette section 120 while further providing energy transfer therebetween. Another feature provides a relatively easy insertion utilizinga tapered guide. To reduce noise and vibrations that may occur, as wellas account from manufacturing process variation, cassette section 120may include features that fill gaps or insulate components.

FIG. 3 is a diagram of cassette section 120 of high-density solid-statestorage unit 100 of FIG. 1 in one embodiment according to the presentinvention. In various embodiments, cassette section 120 includes one ormore features for providing access to and security of data stored withinthe multiple storage modules. Some of these features relate to thepackaging of cassette section 120, such as how the data can bephysically secured through removal of cassette section 120 from basesection 110. For example, cassette section 120 can be physically removedfrom base section 110 may secured in a safe location, such as a vault orsafe. In one aspect, cassette section 120 includes all data and metadatanecessary to resume operation when re-inserted into base section 110.

Some of these features relate to the packaging of cassette section 120,such as how the multiple storage modules and other hardware elements ofcassette section 120 remain undamaged during operation of high-densitysolid-state storage unit 100. Mechanical motion of fans, thermalexpansion and contraction, and other energy pollutions can damagesensitive components, electrical connections, or corrupt data. In oneaspect, cassette section 120 includes one or more points at which heatand vibration may be transferred to base section 110 allowing componentsof cassette section 120 to operate within optimal conditions.

In various embodiments, some of these features relate to the security ofdata stored within cassette section 120, such as how cassette section120 incorporates a trusted platform model that enables access toencrypted data stored within. Even with cassette section 120 physicallyremoved from base section 110 and secured in a safe location, a user maystill further remove the trusted platform module (or key) and store thekey in a separate location. Because cassette section 120 may include alldata and metadata necessary to resume operation when inserted into basesection 110, a combination of the key and cassette section 120 arerequired.

Accordingly, cassette section 120 may be packaged to secure the data byproviding an optimal environment at which elements may operate.Furthermore, cassette section 120 may be physically removed from basesection 110 to secure the data from theft, fire, or other physicaldamage. Additionally, the key to cassette section 120 may be physicallyremoved allowing cassette 120 to remain in base section 110 whilesecuring the data from unauthorized access.

Referring again to FIG. 3, cassette section 120 may include top plate310 and a bottom plate (not shown) that can be removed to allow accessto internal components. In various embodiments, cassette section 120includes a layer of gap filling material 315 between the internalcomponents and the top plate. Some examples of the gap filling material315 include foam or other vibration/acoustic dampening materials.Cassette section 120 may also include a layer of gap filling material315 between the internal components and the bottom plate. The gapfilling material 315 can further account for process variation in themanufacturing process while isolating components and/or structuralelements from one another. The gap filling material 315 may furtherprovide for vibration compensation of internal components of cassettesection 120, such as fans and the like, that are required for optimaloperation. Cassette section 120 further may include other traditionalelements, such as screws, buttons, latches, access ports, and the likethat serve one or more purposes. Cassette section 120 may furtherinclude one or more tamper resistant or temper evident features.

FIGS. 4A-4D are different views illustrating cassette section 120 ofFIG. 3 in one embodiment according to the present invention. Forexample, FIG. 4A depicts a front view of cassette section 120. Cassettesection 110 includes one or more vents at which one or more fans may bemounted to blow air inwards into cassette section 110. FIG. 4Aillustrates one or more screws for securing cassette section 120 to basesection 110 as well as one or more screws for securing a front plate tocassette section 120.

FIG. 4A also depicts one embodiment of a trusted platform module (TPM)(also referred to as a “key” in this disclosure). The TPM or key may beused to secure the data stored within a plurality of high-densityflash-based storage modules. The key may take a variety of forms. Inthis example, the key is depicted as a universal serial bus (USB) stylethumb drive or fob. There are several types of USB connectors, includingsome that have been added while USB specifications have progressed. Theoriginal USB specification details Standard-A and Standard-B plugs andreceptacles. The USB 2.0 specification added Mini-B plugs andreceptacles.

The TPM or key may utilize a standard of custom pin configuration of theUSB style connectors. In general, a USB 2.0 Standard-A type of USB plugis a flattened rectangle that inserts into a USB 2.0 Standard-A typereceptacle. A Standard-B plug has a square shape with bevelled exteriorcorners.

FIG. 4B depicts a back view of high-density solid-state storage unit 100opposing the front view of FIG. 4A. As can be seen, cassette section 110includes one or more vents through which air is transferred fromcassette section 120 to base section 110. Cassette section 120 mayinclude one or more interfaces that facilitate connections (bothstructural and electrical) to base section 110. FIG. 4C depicts a leftview of cassette section 120. Cassette section 120 may include one ormore openings, interfaces, and the like. FIG. 4D depicts a right view ofcassette section 120. In these examples, cassette section 120 includesone or more mechanisms, such as guides and posts, that facilitate theinterconnection with base section 110.

FIG. 5 is a diagram illustrating the packaging of various internalelements of cassette section 120 of FIG. 1 in one embodiment accordingto the present invention. FIG. 5 depicts a top view of cassette section120 with top plate 310 removed. Cassette section 120 typically includesmultiple storage modules 510 arranged side-by-side in a verticalorientation.

Storage modules 510 can be used with high-density solid-state storageunit 100. For example, storage modules 510 may include a flashcontroller and one or more flash modules. The flash controller isrepresentative of one or more processors, FPGAs, ASICs, or othermicrocontrollers that include hardware and/or software elementsconfigured for executing logic or program code or for providingapplication-specific functionality. Flash modules are representative offlash memory modules or other solid-state devices (SSDs). Some examplesof storage modules 510 are provided by Skyera, Inc. of San Jose, Calif.

To maximize the packaging of storage modules 510, cassette section 120includes bridge board 520. Bridge board 520 is configured to provide anelectrical power connection between front section 530 of cassettesection 120 and rear section 540 of cassette section 120 utilizingsubstantially the same form factor as one of storage modules 510. Frontsection 530 may include components configured to interface with the TMPor key as well as to operate one or more fans, buttons, switches, andthe like accessible to a user when interacting with the front ofhigh-density solid-state storage unit 100. Rear section 540 may includecomponents that configured to interface with components of base section110. Rear section 540 may further extend as a circuit board that hasreceptacle interfaces for each of storage modules 510 and bridge board520. Bridge board 520 may further be configured to provide communicationlines between front section 530 of cassette section 120 and rear section540 of cassette section 120.

FIGS. 6A-6B are diagrams illustrating elements of cassette section 120of FIG. 3 that provide security and vibration reduction in oneembodiment of the present invention. In this example, FIG. 6A depictsinterface 610 that may provide a physical connection point for receivinga connection from base section 110. Interface 620 may provide both aphysical and an electrical connection to base section 110. Interface 620is further configured to transfer vibrations or other harmonicsassociated with cassette section 120 into base section 110. Interface620 thus reduces stress on components of cassette section 110, protectsinterface connectors, and physically secures cassette section 120 tobase section 110.

FIG. 6A further depicts one or more guides 630A and 630B. Guides 630Aand 630B are configured to facilitate the insertion and removal ofcassette section 120 into base section 110. Guides 630A and 630B mayfurther provide energy transfer from cassette section 120 to basesection 110. FIG. 6B further depicts guide 630B. Guide 630B is taperedin areas 640 to allow cassette station 120 to pull itself into basestation 110. Areas 640 located opposite each other form wedge receptorsfor receiving guide components of base section 110. Furthermore, guide630B is rounded to form an upper and lower channel from front to back toself-guide as well as provide a better fit. Traditional guides aremerely blocked at right angles and do not account for process variation.Thus, which the guides may fit into their receptors, they may not beentirely secure. In contrast, guides 630A and 630B provide a taper thatensures a secure fit. The secure fit provides protection against backingout as well as providing additional surface area through which energyand vibration transfer may occur.

As discussed above, cassette section 120 includes features in variousaspects for providing security of data stored within. For example,cassette section 120 can be physically removed from base section 110 maysecured in a safe location. In one aspect, cassette section 120 includesall data and metadata necessary to resume operation when inserted intobase section 110. In another example, cassette section 120 includes oneor more points at which heat and vibration may be transferred to basesection 110 allowing components of cassette section 120 to operatewithin optimal conditions.

Dual Temperature Option

Cassette section 120 may implement a cooling system that draws air intothe front of cassette section 120 and blows it across criticalcomponents such as storage modules 510 before exhausting the air out ofthe back of cassette section 120. Because the back of cassette section120 vents into a portion of base section 110, one or more features maybe provided for a plurality of environmental zones. These features mayminimize interference between separate zones as well as consolidate thearea needed for exhaust.

FIG. 7 is a diagram illustrating a cross section of cassette section 120of FIG. 3 having dual temperature zones in one embodiment of the presentinvention. In this example, base station 110 is outfitted with one ormore features to provide dual environmental zones. The need for multipleenvironmental zones may be based on requirements for optimal operationof certain components. Accordingly, some components may be able tooperate under different conditions and these considerations may be usedto design a more compact and efficient enclosure.

In this example, structure 710 of FIG. 7 is configured to separateairflow exiting cassette section 120 and airflow exiting base section110. In this embodiment, structure 710 forms a ramp separating the twoairflows into zone 720 and zone 730. Structure 710 may include one ormore deformations, ramps, wings, blockages, enclosures, and the likethat separate a space into a plurality of zones or partitions.

Therefore, components of cassette section 120 may be able to operateunder different conditions from components of base section 110. Thus thecooling strategy of cassette section 110 may be different from thecooling strategy of base section 110 without incurring substantialinterference with or comprising efficiency of another zone.Incorporating separate zones where at least one zone is designated for aremoval cassette also allows for a more compact and efficient enclosuredesign, both of cassette 120 and base section 110.

Data Security

As discussed above, high-density solid-state storage unit 100 includesone or more features for securing the data stored within cassette 120,both physically and cryptographically. In one embodiment, high-densitysolid-state storage unit 100 utilizes a Trusted Platform Module (TPM).In various embodiments, the TPM or key is a specialized removable moduleutilizing a USB-style connector. The key includes hardware and/orinformation necessary for accessing data stored in storage modules 520under its protection. The key can store encryption keys specific tocassette station 120. The key can also provide for platform integrity inthat attest that high-density solid-state storage unit 100 has aspecified hardware setup and is using specified software.

FIG. 8 is a diagram illustrating a data security feature of cassettestation 120 of FIG. 3 in one embodiment of the present invention. Inthis example, TPM chip 800 contains a key pair called the EndorsementKey (EK). The pair is maintained inside TPM chip 800 and cannot beaccessed by software. The Storage Root Key (SRK) is created when a useror administrator takes ownership of the system. This key pair may begenerated by TPM chip 800 based on the Endorsement Key and anowner-specified password. A second key, called an Attestation IdentityKey (AIK) may be used to protect cassette station 120 againstunauthorized firmware and software modification.

Accordingly, even if cassette section 120 is physically removed frombase section 110 all data and metadata necessary to resume operationwhen inserted into base section 110 remains secured by TPM chip 800.Simply removing TPM chip 800 from cassette station 120 further preservesthe security if the data even if physical access is later obtained tothe storage modules within.

Thus, in various embodiments, data stored within cassette section 120can be secured by removing TPM chip 800. Cassette 120 may be left withinbase section 110 while preventing unauthorized access. Even withcassette section 120 physically removed from base section 110, TPM chip800 may be removed further stored in a separate location. Even if anunauthorized use reconnects cassette section 110 to base section 120,data stored within cassette section 120 remains encrypted and otherwisesecured. In one aspect, cassette section 120 and base section 110 mayrefuse to operate without the presence of TPM chip 800. When cassettesection 120 includes all data and metadata necessary to resume operationwhen inserted into base section 110, a combination of TPM chip 800 andcassette section 120 are required.

TPM chip 800 may take a variety of forms. In this example, TPM chip 800is depicted as USB-style thumb drive or fob. TPM chip 800 includes a USB2.0 Standard-A type of USB plug with a flattened rectangle that insertsinto a USB 2.0 Standard-A type receptacle of cassette section 120. Mosthardware-based security device that addresses boot process integrity ordata protection are typically modules that connect to a system using aproprietary interface designed by the manufacture. Additionally, themodules are often constructed as small daughter board style cards ormodules connected with tamper-evident or tamper resistant fastenerswithin the system's enclosures. TPM chip 800 provides a connectorutilizing a well-known standard of construction. TPM chip 800 whenembodied as a USB-style thumb drive or fob further provides somethingfamiliar to users.

Conclusion

FIG. 9 is a simplified block diagram of computer system 900 that may beused to practice embodiments of the present invention. As shown in FIG.9, computer system 900 includes processor 910 that communicates with anumber of peripheral devices via bus subsystem 920. These peripheraldevices may include storage subsystem 930, comprising memory subsystem940 and file storage subsystem 950, input devices 960, output devices970, and network interface subsystem 980.

Bus subsystem 920 provides a mechanism for letting the variouscomponents and subsystems of computer system 900 communicate with eachother as intended. Although bus subsystem 920 is shown schematically asa single bus, alternative embodiments of the bus subsystem may utilizemultiple busses.

Storage subsystem 930 may be configured to store the basic programmingand data constructs that provide the functionality of the presentinvention. Software (code modules or instructions) that provides thefunctionality of the present invention may be stored in storagesubsystem 930. These software modules or instructions may be executed byprocessor(s) 910. Storage subsystem 930 may also provide a repositoryfor storing data used in accordance with the present invention. Storagesubsystem 930 may comprise memory subsystem 940 and file/disk storagesubsystem 950.

Memory subsystem 940 may include a number of memories including a mainrandom access memory (RAM) 942 for storage of instructions and dataduring program execution and a read only memory (ROM) 944 in which fixedinstructions are stored. File storage subsystem 950 provides persistent(non-volatile) storage for program and data files, and may include ahard disk drive, a floppy disk drive along with associated removablemedia, a Compact Disk Read Only Memory (CD-ROM) drive, a DVD, an opticaldrive, removable media cartridges, and other like storage media.

Input devices 960 may include a keyboard, pointing devices such as amouse, trackball, touchpad, or graphics tablet, a scanner, a barcodescanner, a touchscreen incorporated into the display, audio inputdevices such as voice recognition systems, microphones, and other typesof input devices. In general, use of the term “input device” is intendedto include all possible types of devices and mechanisms for inputtinginformation to computer system 900.

Output devices 970 may include a display subsystem, a printer, a faxmachine, or non-visual displays such as audio output devices, etc. Thedisplay subsystem may be a cathode ray tube (CRT), a flat-panel devicesuch as a liquid crystal display (LCD), or a projection device. Ingeneral, use of the term “output device” is intended to include allpossible types of devices and mechanisms for outputting information fromcomputer system 900.

Network interface subsystem 980 provides an interface to other computersystems, devices, and networks, such as communications network 990.Network interface subsystem 980 serves as an interface for receivingdata from and transmitting data to other systems from computer system900. Some examples of communications network 990 are private networks,public networks, leased lines, the Internet, Ethernet networks, tokenring networks, fiber optic networks, and the like.

Computer system 900 can be of various types including a personalcomputer, a portable computer, a workstation, a network computer, amainframe, a kiosk, or any other data processing system. Due to theever-changing nature of computers and networks, the description ofcomputer system 900 depicted in FIG. 9 is intended only as a specificexample for purposes of illustrating the preferred embodiment of thecomputer system. Many other configurations having more or fewercomponents than the system depicted in FIG. 9 are possible.

Although specific embodiments of the invention have been described,various modifications, alterations, alternative constructions, andequivalents are also encompassed within the scope of the invention. Thedescribed invention is not restricted to operation within certainspecific data processing environments, but is free to operate within aplurality of data processing environments. Additionally, although thepresent invention has been described using a particular series oftransactions and steps, it should be apparent to those skilled in theart that the scope of the present invention is not limited to thedescribed series of transactions and steps.

Further, while the present invention has been described using aparticular combination of hardware and software, it should be recognizedthat other combinations of hardware and software are also within thescope of the present invention. The present invention may be implementedonly in hardware, or only in software, or using combinations thereof.

The specification and drawings are, accordingly, to be regarded in anillustrative rather than a restrictive sense. It will, however, beevident that additions, subtractions, deletions, and other modificationsand changes may be made thereunto without departing from the broaderspirit and scope of the invention as set forth in the claims.

Various embodiments of any of one or more inventions whose teachings maybe presented within this disclosure can be implemented in the form oflogic in software, firmware, hardware, or a combination thereof. Thelogic may be stored in or on a machine-accessible memory, amachine-readable article, a tangible computer-readable medium, acomputer-readable storage medium, or other computer/machine-readablemedia as a set of instructions adapted to direct a central processingunit (CPU or processor) of a logic machine to perform a set of stepsthat may be disclosed in various embodiments of an invention presentedwithin this disclosure. The logic may form part of a software program orcomputer program product as code modules become operational with aprocessor of a computer system or an information-processing device whenexecuted to perform a method or process in various embodiments of aninvention presented within this disclosure. Based on this disclosure andthe teachings provided herein, a person of ordinary skill in the artwill appreciate other ways, variations, modifications, alternatives,and/or methods for implementing in software, firmware, hardware, orcombinations thereof any of the disclosed operations or functionalitiesof various embodiments of one or more of the presented inventions.

The disclosed examples, implementations, and various embodiments of anyone of those inventions whose teachings may be presented within thisdisclosure are merely illustrative to convey with reasonable clarity tothose skilled in the art the teachings of this disclosure. As theseimplementations and embodiments may be described with reference toexemplary illustrations or specific figures, various modifications oradaptations of the methods and/or specific structures described canbecome apparent to those skilled in the art. All such modifications,adaptations, or variations that rely upon this disclosure and theseteachings found herein, and through which the teachings have advancedthe art, are to be considered within the scope of the one or moreinventions whose teachings may be presented within this disclosure.Hence, the present descriptions and drawings should not be considered ina limiting sense, as it is understood that an invention presented withina disclosure is in no way limited to those embodiments specificallyillustrated.

Accordingly, the above description and any accompanying drawings,illustrations, and figures are intended to be illustrative but notrestrictive. The scope of any invention presented within this disclosureshould, therefore, be determined not with simple reference to the abovedescription and those embodiments shown in the figures, but insteadshould be determined with reference to the pending claims along withtheir full scope or equivalents.

What is claimed is:
 1. A data storage unit comprising: a base section; acassette section configured to be removably attached to the base sectionand having an interface through which solid-state storage moduleslocated within the cassette section are accessible to the base section;and a removable trusted platform module configured to provide securityto the solid-state storage modules by authorizing operation of thecassette section and the base section when the cassette section isconnected to the base section; wherein a plurality of solid-statestorage modules are arranged in a vertical fashion from the front of thecassette section to the back of the cassette section together with abridge board that electronically connects the interface at the back ofthe cassette section to one or more components at the front of thecassette section; wherein the cassette section further includes a gapfilling material positioned between one or more internal components ofthe cassette section and an enclosing plate of the cassette section; andwherein the gap filling material is futher configured to reducevibration within the cassette section.
 2. The data storage unit of claim1 wherein the interface is configured to provide both an electricalconnection between the cassette section and the base section as well asa mechanical connection between the cassette section and the basesection.
 3. The data storage unit of claim 1 wherein the cassettesection further includes one or more guides placed on each of one ormore surfaces, each guide having a taper from one end of the cassettesection toward another end of the cassette section.
 4. The data storageunit of claim 3 wherein the one or more guides are configured with aplurality of rounded channels diametrically opposed.
 5. The data storageunit of claim 3 wherein the one or more guides include a first wedgereceptor opposite a second wedge receptor.
 6. The data storage unit ofclaim 1 wherein the base section includes one or more structures forminga plurality of environmental zones configured to separate airflowexiting the cassette section and airflow exiting the base section, atleast one of the plurality of environmental zones designated for thecassette section.
 7. The data storage unit of claim 1 wherein thetrusted platform module is a chip included in a universal serial bus(USB) style connector.
 8. The data storage unit of claim 1 wherein thetrusted platform module utilizes a universal serial bus (USB) styleconnector configured to be inserted into the cassette section.
 9. Thedata cassette of claim 1 wherein the trusted platform module is a chipincluded in a universal serial bus (USB) style connector configured tobe inserted into the data section.
 10. The data storage unit of claim 1wherein the cassette section is configured to be insertable only into apre-designated base section.
 11. A data cassette comprising: aninterface through which solid-state storage modules are accessible to abase section; a removable trusted platform module configured to providesecurity to the solid-state storage modules by authorizing operation ofthe cassette section and the base section when the cassette section isconnected to the base section; and a plurality of solid-state storagemodules arranged in a vertical fashion from the front of the cassettesection to the back of the cassette section together with a bridge boardthat electronically connects the interface at the back of the cassettesection to one or more components at the front of the cassette section;wherein the cassette section section further includes a gap fillingmaterial positioned between one or more internal components of the datacassette and a top plate of the data cassette or a bottom plate of thedata cassette; and wherein the gap filling material is furtherconfigured to reduce vibration within the cassette section.
 12. The datacassette of claim 11 wherein the interface is configured to provide bothan electrical connection between the data cassette and the base sectionas well as an energy transfer to the base section.
 13. The data cassetteof claim 1 further including one or more guides having a taper directfrom the back of the data cassette to the front of the data cassettethat provides self-guiding upon insertion of the data cassette into thebase section.
 14. The data cassette of claim 13 wherein the one or moreguides are configured to provide energy transfer to the base section.15. The data cassette of claim 13 wherein the one or more guides includea first wedge receptor opposite a second wedge receptor.
 16. The datacassette of claim 11 is further configured to be insertable only into apre-designated base section.